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ap2301/ap2311 document number: ds32241 rev. 4 - 2 1 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 2.0a single channel current-limited power switch description the ap2301 and ap2311 are single channel current-limited integrated high-side power switches optimized for universal serial bus (usb) and other hot-swap applications. the family of devices complies with usb standards and is available with both polarities of enable input. the devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. they provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature and short-circuit protection, as we ll as controlled rise time and under- voltage lockout functionality. a 7ms deglitch capability on the open- drain flag output prevents false ov er-current reporting and does not require any external components. all devices are available in so-8, msop-8, msop-8ep, u-dfn3030- 8 and u-dfn2020-6 packages. features ? single channel current-limited power switch ? output discharge function ? fast short-circui t response time: 2s ? 2.5a accurate current limiting ? reverse current blocking ? 70m ? on-resistance ? input voltage range: 2.7v - 5.5v ? built-in soft-start with 0.6ms typical rise time ? over-current and thermal protection ? fault report (flg) with blanking time (7ms typ) ? esd protection: 2kv hbm, 200v mm ? ambient temperature range: -40c to +85c ? so-8, msop-8, msop-8ep, u-dfn3030-8 and u-dfn2020-6: available in ?green? molding compound (no br, sb) ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? ul recognized, file number e322375 ? iec60950-1 cb scheme certified pin assignments ( top view ) 1 2 3 4 8 7 6 5 nc out flg out gnd en in in so-8 1 2 3 4 8 7 6 5 out flg out gnd en in in ( top view ) nc msop-8 /msop-8ep note: latter with exposed pad (dotted line) en gnd nc 1 in flg in out out u-dfn3030-8 type e (top view) 2 3 4 8 7 6 5 u-dfn2020-6 applications ? lcd tvs & monitors ? set-top-boxes, residential gateways ? laptops, desktops, servers, e-readers, printers, docking stations, hubs notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds.
ap2301/ap2311 document number: ds32241 rev. 4 - 2 2 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical applications circuit 0.1uf in gnd en out on 120uf power supply 2.7v to 5.5v 0.1uf off flg load 10k enable active high available options part number channel enable pin (en) recommended maximum continuous load current (a) typical current limit (a) package ap2301 1 active low 2a 2.5a so-8 msop-8 msop-8ep u-dfn3030-8 u-dfn2020-6 ap2311 1 active high pin descriptions pin name pin number function so-8, msop-8 msop-8ep, u-dfn3030-8 u-dfn2020-6 gnd 1 1 2 ground in 2, 3 2, 3 1 voltage input pin; connect a 0.1f or larger ceramic capacitor from in to gnd as close as possible. (all in pins must be tied together externally) en 4 4 3 enable input, active low (ap2301) or active high (ap2311) flg 5 5 4 over-temperature and over-current fault r eporting with 7ms deglitch; active low open- drain output. flg is disabled for 7ms after turn-on. out 6, 7 6, 7 5 voltage output pin all out pins must be tied together externally. nc 8 8 6 nc: no internal connection; recommend tie to out pins exposed pad ? exposed pad exposed pad exposed pad. it should be externally connected to gnd and thermal mass for enhanced thermal impedance. it should not be used as electrical ground conduction path.
ap2301/ap2311 document number: ds32241 rev. 4 - 2 3 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 functional block diagram thermal sense flg out gnd in en uvlo current limit current sense deglitch discharge control driver absolute maximum ratings (@t a = +25c, unless otherwise specified.) symbol parameter ratings unit esd hbm human body model esd protection 2 kv esd mm machine model esd protection 200 v v in input voltage (note 4) -0.3 to 6.5 v v out output voltage (note 4) -0.3 to (v in +0.3) or 6.5 v v en , v flg enable voltage (note 4) -0.3 to (v in +0.3) or 6.5 v i load maximum continuous load current internal limited a t j(max) maximum junction temperature 150 c t st storage temperature range (note 5) -65 to +150 c notes: 4. all voltages referred to gnd pin. maximums are the lower of (v in +0.3) and 6.5v 5. ul recognized rating from -30c to +70c (diodes qualified t st from -65c to +150c) caution: stresses greater than th e 'absolute maximum ratings' specified above, may cause permanent dam age to the device. t hese are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. semiconductor devices are esd sensitive and may be damaged by exposure to esd events. suitab le esd precautions should be t aken when handling and transporting these devices. recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter min max unit v in input voltage 2.7 5.5 v i out output current 0 2 a v il en input logic low voltage 0 0.8 v v ih en input logic high voltage 2 v in v t a operating ambient temperature -40 +85 ? c
ap2301/ap2311 document number: ds32241 rev. 4 - 2 4 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 electrical characteristics (@t a = +25c, v in = +5v, c in = 0.1f, c l = 1f, unless otherwise specified.) symbol parameter test conditions min typ max unit v uvlo input uvlo v in rising 1.6 2.0 2.4 v v uvlo input uvlo hysteresis v in decreasing 50 mv i shdn input shutdown current disabled, out = open 0.1 1 a i q input quiescent current enabled, out = open 60 100 a i leak input leakage current disabled, out grounded 0.1 1 a i rev reverse leakage current disabled, v in = 0v, v out = 5v, i rev at v in 0.01 1 a r ds(on) switch on-resistance v in = 5v, i out = 2.0a t a = +25c 70 84 m ? -40c t a +85c 105 v in = 3.3v, i out = 2.0a t a = +25c 90 108 -40c t a +85c 135 i limit over-load current limit (note 6) v in = 5v, v out = 4.5v -40c t a +85c 2.05 2.50 2.85 a i trig current limiting trigger threshold output current slew rate (<100a/s) 2.5 a i short short-circuit current limit enabl ed into short circuit 2.75 a t short short-circuit response time v out = 0v to i out = i limit (out shorted to ground) 2 s v il en input logic low voltage v in = 2.7v to 5.5v 0.8 v v ih en input logic high voltage v in = 2.7v to 5.5v 2 v i leak-en en input leakage v in = 5v, v en = 0v and 5.5v 0.01 1 a i leak-o output leakage current disabled, v out = 0v 0.5 1 a t d(on) output turn-on delay time c l = 1f, r load = 5 ? 0.1 ms t r output turn-on rise time c l = 1f, r load = 5 ? 0.6 1.5 ms t d(off) output turn-off delay time c l = 1f, r load = 5 ? 0.1 ms t f output turn-off fall time c l = 1f, r load = 5 ? 0.05 0.1 ms r flg flg output fet on-resistance i flg = 10ma 20 40 ? i foh flg off current v flg = 5v 0.01 1 a t blank flg blanking time assertion or deassertion due to overcurrent and over- temperature condition 4 7 15 ms t dis discharge time c l = 1f, v in = 5v, disabled to v out < 0.5v 0.6 ms r dis discharge resistance (note 7) v in = 5v, disabled, i out = 1ma 100 ? t shdn thermal shutdown threshold enabled 140 ? c t hys thermal shutdown hysteresis 20 ? c ja thermal resistance junction-to- ambient so-8 (note 8) 96 ? c/w msop-8 (note 8) 130 ? c/w msop-8-ep (note 9) 92 ? c/w u-dfn3030-8 (note 9) 84 ? c/w u-dfn2020-6 (note 10) 90 c/w notes: 6. pulse-testing techniques maintain junction temperature close to ambient tem perature; thermal effects must be taken i nto account separately. 7. the discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when v in < v uvlo ). the discharge function offers a resistive discharge path for the external storage capacitor for limited time. 8. device mounted on 2? x 2? fr-4 substrate pcb, 2oz copper, with minimum recommended pad layout. 9. device mounted on 2? x 2? fr-4 substrate pcb, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 10. device mounted on 1"x1" fr-4 substrate pcb, 2oz copper, with minimum recommended padon top layer and thermal vias to botto m layer ground.
ap2301/ap2311 document number: ds32241 rev. 4 - 2 5 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical performance characteristics v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f figure 1. voltage waveforms: ap2301 (left), ap2311 (right) all enable plots are for enable active low turn-off delay and fall time t a =25c v in =5v c l =120uf r out =2.5 ? v out 2v/div v en 5v/div i in 1a/div device disabled turn-on delay and rise time t a =25c v in =5v c l =120uf r out =2.5 ? v out 2v/div v en 5v/div i in 1a/div inrush current limit device enabled turn-off delay and fall time t a =25c v in =5v c l =1uf r out =2.5 ? v out 2v/div v en 5v/div i in 1a/div device disabled turn-on delay and rise time t a =25c v in =5v c l =1uf r out =2.5 ? v out 2v/div v en 5v/div i in 1a/div device enabled
ap2301/ap2311 document number: ds32241 rev. 4 - 2 6 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical performance characteristics (cont.) v out 2v/div short-circuit to no-load recovery response flg 5v/div t a =25c v in =5v r out =0 ? output short circuit r emoved short circuit present and device thermal cycles i in 2a/div t a =25c v in =5v r out =0 ? v out 2v/div flg 5v/div i in 2a/div no-load to short-circuit transient response output short circuited device enters current limit v out 2v/div short-circuit to full-load recovery response flg 5v/div t a =25c v in =5v r out =2.5 ? output short circuit r emoved short circuit present and device thermal cycles i in 2a/div t a =25c v in =5v r out =2.5 ? v out 2v/div flg 5v/div i in 2a/div full-load to short-circuit transient response output short circuited device turns off and re-enables into current limit inrush current t a =25c v in =5v r out =2.5 ? v en 5v/div i out 1a/div c l =120uf c l =220uf c l =470uf device enabled into short-circuit t a =25c v in =5v c l =120uf r out =1 ? v en 5v/div i out 1a/div
ap2301/ap2311 document number: ds32241 rev. 4 - 2 7 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical performance characteristics (cont.) v in 2v/div uvlo decreasing t a =25c v in =5v r out =2.5 ? c l =120uf i out 2a/div v in 2v/div i out 2a/div uvlo increasing t a =25c v in =5v r out =2.5 ? c l =120uf v out 5v/div short-circuit with blanking time and recovery i out 2a/div flg 5v/div t a =25c v in =5v t a =25c v in =5v r out =2.5 ? c l =120uf v out 5v/div flg 5v/div i out 1a/div power on v in 5v/div
ap2301/ap2311 document number: ds32241 rev. 4 - 2 8 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical performance characteristics (cont.) turn-on time vs. input voltage 0 10 20 30 40 50 60 70 80 90 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage (v) turn-on time (us) turn-off time vs. input voltage 0 20 40 60 80 100 120 140 160 180 200 220 240 260 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage (v) turn-off time (us) rise time vs. input voltage 0 100 200 300 400 500 600 700 800 900 1000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage (v) rise time (us) fall time vs. input voltage 0 10 20 30 40 50 60 70 80 90 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage (v) fall time (us) c l =1uf r l =5 ? t a =25c c l =1uf r l =5 ? t a =25c
ap2301/ap2311 document number: ds32241 rev. 4 - 2 9 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 typical performance characteristics (cont.) supply current,output enabled vs. temperature 0 10 20 30 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 125 temperature (c) supply current output enabled (ua) supply current,output disabled vs. temperature -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 temperature (c) supply current output disabled (ua) r ds( on) vs. temperature 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 -50 -25 0 25 50 75 100 125 temperature (c) r ds(on) (m ? ) short-circuit output current vs. temperature 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 -50 -25 0 25 50 75 100 125 temperature (c) short-circuit output current (a) undervoltage lockout vs. temperature 1.6 1.7 1.8 1.9 2.0 2.1 2.2 -50 -25 0 25 50 75 100 125 temperature (c) undervoltage lockout (v) threshold trip current vs. input voltage 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage (v) threshold trip current (a) v in =5.5v v in =5v v in =2.7v v in =3.3v v in =5.5v v in =5v v in =3.3v v in =2.7v v in =2.7v v in =3.3v v in =5.5v v in =5v v in =2.7v v in =3.3v v in =5v v in =5.5v c l =120uf t a = 25 c uvlo rising uvlo falling
ap2301/ap2311 document number: ds32241 rev. 4 - 2 10 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 application information power supply considerations a 0.1 f to 2.2 f x7r or x5r ceramic bypass capacitor placed between in and g nd, close to the device, is recommended. when an external power supply is used, or an additional ferri te bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circ uit condition. in this case a 2.2 f or bigger capacitor is recommended. placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the out put load is heavy. this prec aution reduces power-supply tra nsients that may cause ringing on the input. additionally , bypassing the output with a 0.1 f to 1.0 f ceramic capacitor improves the immunity of the device to short circuit transients. over-current and short circuit protection an internal sensing fet is employed to c heck for over-current conditions. unlike curr ent-sense resistors, sense fets do not inc rease the series resistance of the current path. when an ov er-current condition is detected, the devic e maintains a constant output current and reduces the output voltage accordingly. complete shutdown occurs only if the fault stays long enough to activate thermal limiting. three possible overload conditions can occur. in the first condition, the output has been shorted to gnd before the device is e nabled or before v in has been applied. the ap2301/ap2311 senses the s hort circuit and immediately clamps output current to a certain safe level name ly i limit . in the second condition, an output short or an overload occurs wh ile the device is enabled. at the instance the overload occur s, higher inrush current may flow for a very short period of time before the cu rrent limit function can react. the input capacitor(s) rapidly di scharge through the device, activating current limit circuitr y. protection is achieved by momentaril y opening the p-mos high-side power switch and then gradually turning it on. after the current limit function has tripped (reac hed the over-current trip thres hold), the device switches int o current limiting mode and the current is clamped at i limit . in the third condition, the load has been gradually increased beyond the recommended operating current. the current is permitte d to rise until the current-limit threshold (i trig ) is reached or until the thermal limit of the device is exceeded. the ap2301/ap2311 is capable of delivering current up to the current-limit threshold without damaging the device. once the threshold has been reached, the device switches into its c urrent limiting mode and is set at i limit . flg response when an over-current or over-temperature s hutdown condition is encountered, the flg open -drain output goes active low after a n ominal 7-ms deglitch timeout. the flg output remains low until both over-cur rent and over-temperature condi tions are removed. connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the flg due to the 7-ms d eglitch timeout. the ap2301/ap2311 is designed to eliminate fals e over-current reporting without the need of external components to remove unwan ted pulses. power dissipation and junction temperature the low on-resistance of the internal mosfet allows the small surface-mount packages to pass large current. using the maximum o perating ambient temperature (t a ) and r ds(on) , the power dissipation can be calculated by: p d = r ds(on) i 2 finally, calculate the junction temperature: t j = pd x r ja + t a where: t a = ambient temperature c r ja = thermal resistance p d = total power dissipation thermal protection thermal protection prevents the ic from damage when heavy-overl oad or short-circuit faults are present for extended periods of time. the ap2301/ap2311 implements a thermal sensing to monitor the operati ng junction temperature of the power distribution switch. once the die temperature rises to approximately 140c due to excessive power di ssipation in an over-current or short-circuit condition the i nternal thermal sense circuitry turns the power switch off, thus preventing the power sw itch from damage. hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 20c before the switch turns back on. the switch continues to cycle in this manner until the load fault or input power is removed. the flg open-drain output is asserted when an ove r-temperature shutdown or over-current occurs with 7-ms degl itch. under-voltage lockout (uvlo) under-voltage lockout function (uvlo) keeps the internal power switch from being turned on until the power supply has reached a t least 2v, even if the switch is enabled. whenever the input voltage falls below appro ximately 2v, the power switch is quickly turned off. this fa cilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
ap2301/ap2311 document number: ds32241 rev. 4 - 2 11 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 application information (cont.) discharge function the discharge function of the device is ac tive when enable is disabled or de-asserted. the discharge function with the n-mos po wer switch implementation is activated and offers a re sistive discharge path for the external st orage capacitor. this is designed for dis charging any residue of the output voltage when either no external output resi stance or load resistance is present at the output. ordering information part number package code packaging 7?/13? tape and reel quantity part number suffix ap23x1sg-13 s so-8 2500/tape & reel -13 ap23x1m8g-13 m8 msop-8 2500/tape & reel -13 ap23x1mpg-13 mp msop-8ep 2500/tape & reel -13 ap23x1fgeg-7 fge u-dfn3030-8 type e 3000/tape & reel -7 ap23x1sn-7 sn u-dfn2020-6 3000/tape & reel -7 marking information (1) so-8
ap2301/ap2311 document number: ds32241 rev. 4 - 2 12 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 marking information (cont.) (2) msop-8 (3) msop-8ep (4) u-dfn3030-8 type e xx : identification code ( top view ) x : a~z : green x y x x w y : year : 0~9 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap2301fgeg-7 u-dfn3030-8 bb ap2311fgeg-7 u-dfn3030-8 bc (5) u-dfn2020-6 xx : identification code ( top view ) x : a~z : internal code x y xx w y : year : 0~9 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap2301sn-7 u-dfn2020-6 db ap2311sn-7 u-dfn2020-6 dc
ap2301/ap2311 document number: ds32241 rev. 4 - 2 13 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (1) package type: so-8 (2) package type: msop-8 so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 ?? 0 ? 8 ? all dimensions in mm msop-8 dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 a a1 a2 e seating plane gauge plane l see detail c detail c c a e1 e3 a3 1 e y x d b 0.25 4 x 1 0 4 x 1 0
ap2301/ap2311 document number: ds32241 rev. 4 - 2 14 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 package outline dimensions (cont.) (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (3) package type: msop-8ep (4) package type: u-dfn3030-8 type e (5) package type: u-dfn2020-6 msop-8ep dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 d1 1.60 2.00 1.80 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e2 1.30 1.70 1.50 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm u-dfn3030-8 type e dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.02 a3 ?? ?? 0.15 b 0.20 0.30 0.25 d 2.95 3.05 3.00 d2 2.15 2.35 2.25 e 2.95 3.05 3.00 e ?? ?? 0.65 e2 1.40 1.60 1.50 l 0.30 0.60 0.45 z ?? ?? 0.40 all dimensions in mm u-dfn2020-6 dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.03 a3 ?? ?? 0.15 b 0.20 0.30 0.25 d 1.95 2.075 2.00 d2 1.45 1.65 1.55 e ?? ?? 0.65 e 1.95 2.075 2.00 e2 0.76 0.96 0.86 l 0.30 0.40 0.35 all dimensions in mm b (x8) e l (x8) a1 a3 z (x4) d d2 e2 e a 1 d a a1 a2 e e y x seating plane gauge plane l d 8xb see detail c detail c c a e1 e3 a3 e2 4 x 1 0 4 x 1 0 0.25 d1 seating plane d2 d e pin#1 id l b d2/2 e2 e a1 a a3
ap2301/ap2311 document number: ds32241 rev. 4 - 2 15 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) package type: so-8 (2) package type: msop-8 (3) package type: msop-8ep dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 dimensions value (in mm) c 0.650 x 0.450 y 1.350 y1 5.300 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 x c y y1 x c1 c2 y g x c y y2 y1 x1
ap2301/ap2311 document number: ds32241 rev. 4 - 2 16 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 suggested pad layout (cont.) please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (4) package type: u-dfn3030-8 type e (5) package type: u-dfn2020-6 dimensions value (in mm) c 0.65 c1 2.35 x 0.30 y 0.65 y1 1.60 y2 2.75 dimensions value (in mm) z 1.67 g 0.15 x1 0.90 x2 0.45 y 0.37 c 0.65 y (x8) x (x8) c c1 y1 y2 g g yc z y x2 x1
ap2301/ap2311 document number: ds32241 rev. 4 - 2 17 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 taping orientation (note 11) for u-dfn2020-6 and u-dfn3030-8 type e note: 11. the taping orientation of the other package type c an be found on our website at http://www.diodes .com/datasheets/a p02007.pdf
ap2301/ap2311 document number: ds32241 rev. 4 - 2 18 of 18 www.diodes.com march 2013 ? diodes incorporated ap2301/ap2311 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com

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